Electroless nickel–phosphorus coating on boron carbide particles

Kılıçarslan, Ayfer; Toptan, Fatih; Kerti, Işıl

doi:10.1016/j.matlet.2012.02.037

Cited by 24 publications

(13 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It restricts their use in some electronic field, such as electromagnetic interference (EMI) shielding. Wang et al [4] reported that the average shielding effectiveness (SE) of PEEK composites with 7 wt% multiwalled carbon nanotubes (MWCNT) loading was only about 10 dB for frequencies lower than 8 GHz, though it reached 40 dB in [8][9][10][11][12] Copper is an excellent conductor of electricity and can absorb and reflect EMI. Jiang et al [5] reported that the SE value of Cu-Ni-P plated polyester fabric reached 70 dB in 2-18 GHz.…”

Section: Introductionmentioning

confidence: 99%

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Zhai

Ding

et al. 2015

Materials Letters

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Zhai

Ding

et al. 2015

Materials Letters

View full text Add to dashboard Cite

“…Hajizamani et al reported of the formation of Ni 3 P nano-scale layer on B 4 C nanoparticles in acidic bath using a constant pH and bath temperature as well as the same pre-treatment condition [10]. Their results were not in agreement with a study be Kilicarslan et al [9], in which it was found that fine powders could not be covered completely by nickel coating. They used an attrition ball-mill to reduce the particle size of B 4 C via continuous fragmentation of ceramic brittle powders.…”

Section: Introductionmentioning

confidence: 87%

“…These particles are more suitable for electrical, magnetic and chemical properties and have improved wettability compared to non-coated particles [1][2][3][4][5][6][7][8][9][10][11]. Poor binding between molten metal and non-coated ceramic particles is a consequence of their low wetting behavior.…”

Section: Introductionmentioning

confidence: 99%

“…The vast majority of EN coatings are deposited by catalytic reduction of nickel ions with sodium hypophosphite (NaH 2 PO 2 ). Hypophosphite is one of the strongest reducing agents for the electroless Ni-P coating process which is much cheaper than electroless Ni-B coatings [9][10][11][12][13][14][15]. Several theories were proposed for the mechanism of the electroless nickel process using hypophosphite as a reducing agent.…”

Section: Introductionmentioning

confidence: 99%

“…Kilicarslan et al reported that electroless nickel coating of the coarse B 4 C particles ( with an average particle size of 93 μm) resulted in better surface quality as compared to the fine B 4 C particles (with an average particle size of 32 μm) [9]. They have used a constant pH and bath temperature as well as the same pre-treatment condition.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Effect of electroless coating parameters and ceramic particle size on fabrication of a uniform Ni–P coating on SiC particles

Khosroshahi

Mousavian

Brabazon

2014

Ceramics International

View full text Add to dashboard Cite

The formation of a uniform nickel phosphorous (Ni-P) electroless (EL) coating on micronsized SiC particles was investigated in this study. Metal coated ceramic particles could be used in applications including as the fabrication of cast metal matrix composites.Such ceramic particles have a better wettability in molten metal. In this work, the effects of EL coating parameters, SiC particle size and morphology on the coating uniformity and mechanical bonding at the SiC/Ni-P interface were studied. The results indicated that etching treatment was very effective (especially for coarse powders) on the mechanical bonding at the interface. Theoptimum values of bath temperature and pH were determined to be 50+_2 0 C and 8+_0.2, respectively. The best uniformity and mechanical bonding were obtained for SiC particles with average particle size of 80 μm (considered relatively as coarse powders in this study). The ball milling of SiC particles (with the average particle size of 80 μm) for 1 h led to the formation of a multi-modal particle size distribution which resulted in a non-uniform quality of particulate coating. The larger SiC particles after ball milling were more completely covered by the Ni-P coating compared to the smaller more fragmented particles. The smaller ceramic particles processed via Ni-P EL coating lead to formation of segregated clusters of Ni-P and therefore such ceramic particles contained many uncoated parts.

show abstract

Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Mielewczyk,

Grothe,

Kaskel

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

A high demand for oxide dispersion strengthened (ODS) materials arose in wide fields of application. The electroless plating method has been presented as an elegant way to overcome different surface energies and obtain metal‐plated ceramics. However, copper electroless plating is still performed under harsh conditions with toxic and expensive reagents, including noble metals and harsh reducing agents like formaldehyde and hydrazine. To create a pure copper metal matrix in an environmentally friendly and efficient way a previously reported method is advanced in a way that naturally occurring amino acids are utilized. A screening of several amino acids leads to an improvement in phase purity and atomic efficiency. Therefore, a Maillard type reaction with lysine as amino compound is reported to show the best results in the particle coating for all ceramic nanoparticles evaluated. The metal plating results in uniform round micro particles showing a homogeneous coating. In order to obtain copper matrix composites, the prepared particles are successfully implemented in a PBF‐LB/M process after mixing with a highly conductive copper alloy. The resulting products were investigated by transmission electron microscopy, scanning electron microscopy, powder X‐ray diffraction, and optical density measurements.

show abstract

Electroless nickel–phosphorus coating on boron carbide particles

Cited by 24 publications

References 13 publications

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Effect of electroless coating parameters and ceramic particle size on fabrication of a uniform Ni–P coating on SiC particles

Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Contact Info

Product

Resources

About