Electroless Palladium Plating from an Ethylenediamine Complex Bath using Phosphite as a Reducing Agent

Nawafune, Hidemi; Mizumoto, Shozo; Haga, Masaki; Uchida, Ei

doi:10.1080/00202967.1996.11871084

Cited by 7 publications

(5 citation statements)

References 1 publication

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“…EDA (en, when referred to as a ligand) is a usually bidentate chelating ligand that has been successfully employed as a complexing agent in the electroless deposition of other noble metals including Ag, [32] Pd [76] and Pt. [37,54] Similar to Pt(IV) it is expected that Ir(III)-ions form en-complexes of the type [Ir(en) x L (6-2x) ] (2x-3) with x = 0-3.…”

Section: Eda-stabilized Plating Solutionmentioning

confidence: 99%

Electroless Nanoplating of Iridium: Template‐Assisted Nanotube Deposition for the Continuous Flow Reduction of 4‐Nitrophenol

et al. 2020

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Electroless plating is a powerful tool in nanofabrication and is available for many of the noble transition metals. There is, however, a striking lack of electroless plating procedures for the rarer platinum‐group metals. In this work, two plating baths for nanoscale iridium coatings are developed and their conformality and nanofabrication potential are showcased by coating ion‐track‐etched polycarbonate membranes, creating Ir nanotubes in the process. Both plating solutions yield morphologically different deposits, indicating that the microstructure of the film can be tuned by adjusting the composition of the plating bath. The catalytic performance of the deposited materials is investigated by using membrane‐embedded nanotubes as catalysts for the reduction of 4‐nitrophenol and methyl orange by borohydride, showing remarkable activity and stability. Operation in flow‐through configuration, in which the metallized membrane is implemented as a microreactor greatly enhances the interaction with the catalyst surface, considerably increasing product yield. The results highlight the potential of Ir nanoplating for realizing sophisticated nanostructures and heterogeneous catalysts, but also illustrate the intricacies related to the complex chemistry of electroless Ir plating baths.

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Section: Eda-stabilized Plating Solutionmentioning

confidence: 99%

Electroless Nanoplating of Iridium: Template‐Assisted Nanotube Deposition for the Continuous Flow Reduction of 4‐Nitrophenol

et al. 2020

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“…In addition Stremsdoerfer et al have also reported that palladium deposited using this bath formed a good metal-semiconductor junction (Pd/n-GaAs junction) by subsequent annealing up to 550 C [17]. When phosphite or trimethylamine borane was used as reducing agent, the content of phosphorus in the deposit was reduced [19]. Electroless pure palladium was deposited using the following basic bath composition: 0.01 M palladium chloride, 0.08 M ethylenediamine, 0.2 M formic acid, and pH 6 at 60 .…”

Section: Electroless Plating Bath For Palladiummentioning

confidence: 98%

“…Electroless pure palladium was deposited using the following basic bath composition: 0.01 M palladium chloride, 0.08 M ethylenediamine, 0.2 M formic acid, and pH 6 at 60 . When phosphite or trimethylamine borane was used as reducing agent, the content of phosphorus in the deposit was reduced [19].…”

Section: Hypophosphite Bathsmentioning

confidence: 99%

Electroless Deposition of Palladium and Platinum

Ohno

2010

Modern Electroplating

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“…There are two primary classifications of electroless Pd plating solutions: (1) an autocatalytic bath that is characterized by the redox reaction between Pd ions and a reductant and (2) an immersion bath that is characterized by the displacement reaction between Pd ions and a sacrificial metal such as Cu, Zn. 7 For instance, hypophosphite is implemented as the reducing agent to yield a Pd-P. 8 A pure Pd film with different crystal orientations was obtained using choline chloride as the reductant. 9 In recent years, surface limited redox replacement (SLRR) reactions were implemented to form Pd atomic layers.…”

mentioning

confidence: 99%

“…7 For instance, hypophosphite is implemented as the reducing agent to yield a Pd-P. 8 A pure Pd film with different crystal orientations was obtained using choline chloride as the reductant. 9 In recent years, surface limited redox replacement (SLRR) reactions were implemented to form Pd atomic layers.…”

mentioning

confidence: 99%

Communication—Reaction Processes in Electroless Pd Deposition on Ni-P Surfaces Utilizing Formic Acid as Reducing Agent

et al. 2016

J. Electrochem. Soc.

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Herein, electroless Pd deposited on Ni-P surfaces using formic acid (FA) as a reducing agent was investigated. Open circuit potential with time (OCPT) and cyclic voltammetry (CV) results suggest that electroless Pd deposited on Ni-P surfaces occurs by a two stage reaction. First, Pd plating proceeds via a galvanic displacement reaction between Ni and Pd2+. Subsequently, Pd deposited via autocatalytic reaction takes place on Pd surfaces. When the displacement reaction was prevented, the autocatalytic deposition of palladium was incapable of proceeding; therefore, it is confirmed that the displacement reaction is a necessary prerequisite for occurrence of the autocatalytic reaction.

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Electroless Palladium Plating from an Ethylenediamine Complex Bath using Phosphite as a Reducing Agent

Cited by 7 publications

References 1 publication

Electroless Nanoplating of Iridium: Template‐Assisted Nanotube Deposition for the Continuous Flow Reduction of 4‐Nitrophenol

Electroless Nanoplating of Iridium: Template‐Assisted Nanotube Deposition for the Continuous Flow Reduction of 4‐Nitrophenol

Electroless Deposition of Palladium and Platinum

Communication—Reaction Processes in Electroless Pd Deposition on Ni-P Surfaces Utilizing Formic Acid as Reducing Agent

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