2021
DOI: 10.1007/s10853-021-05862-w
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Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition

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Cited by 7 publications
(2 citation statements)
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“…To this end, the metallization of the polymer-based substrates can represent the potential solution to give them the above-mentioned properties. There exist various conventional methods such as PVD [34] or CVD [35,36], electroplating [37], electroforming [38], and thermal spraying processes that can be used for the surface metallization of polymers and FRPs [39]. However, these techniques suffer from a series of disadvantages, for instance, the high equipment and processing costs, and the size limitations of the workpieces are some of the drawbacks characterizing the former two.…”
Section: Literature Analysismentioning
confidence: 99%
“…To this end, the metallization of the polymer-based substrates can represent the potential solution to give them the above-mentioned properties. There exist various conventional methods such as PVD [34] or CVD [35,36], electroplating [37], electroforming [38], and thermal spraying processes that can be used for the surface metallization of polymers and FRPs [39]. However, these techniques suffer from a series of disadvantages, for instance, the high equipment and processing costs, and the size limitations of the workpieces are some of the drawbacks characterizing the former two.…”
Section: Literature Analysismentioning
confidence: 99%
“…According to Huntington and Stahlmecke [31][32][33], the mass transport direction is determined by two competing forces: the wind force toward the anode (momentum transfer from electrons to ions) and the direct force toward the cathode (Lorentz force acting on ions in the electric field). There are controversial reports on the mass transport direction, where voids appear between the anode and cathode of conductive lines [8,[32][33][34][35][36][37][38][39][40]. These voids are known to be failure locations.…”
Section: Introductionmentioning
confidence: 99%