Electron-Beam Atomic Spectroscopy for In Situ Measurements of Melt Composition for Refractory Metals: Analysis of Fundamental Physics and Plasma Models

Gasper, Paul; Apelian, Diran

doi:10.1007/s11663-014-0229-2

Cited by 3 publications

(2 citation statements)

References 30 publications

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“…Several factors such as the alignment of the e-beam, chosen deposition parameters, and material constants of the evaporation material determine the total amount of this ionization, i.e. the ratio between neutral and ionized vapor densities [17,19,20]. Especially at higher deposition rates, when a virtual source is created slightly above the actual crucible In an e-beam evaporator a hot filament emits electrons due to thermionic emission.…”

Section: Partially Ionized Vapormentioning

confidence: 99%

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

Volmer

Inga

Bißwanger

et al. 2021

J. Phys. D: Appl. Phys.

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We discuss how the emission of electrons and ions during electron-beam-induced physical vapor deposition can cause problems in micro- and nanofabrication processes. After giving a short overview of different types of radiation emitted from an electron-beam (e-beam) evaporator and how the amount of radiation depends on different deposition parameters and conditions, we highlight two phenomena in more detail: First, we discuss an unintentional shadow evaporation beneath the undercut of a resist layer caused by the one part of the metal vapor which got ionized by electron-impact ionization. These ions first lead to an unintentional build-up of charges on the sample, which in turn results in an electrostatic deflection of subsequently incoming ionized metal atoms toward the undercut of the resist. Second, we show how low-energy secondary electrons during the metallization process can cause cross-linking, blisters, and bubbles in the respective resist layer used for defining micro- and nanostructures in an e-beam lithography process. After the metal deposition, the cross-linked resist may lead to significant problems in the lift-off process and causes leftover residues on the device. We provide a troubleshooting guide on how to minimize these effects, which e.g. includes the correct alignment of the e-beam, the avoidance of contaminations in the crucible and, most importantly, the installation of deflector electrodes within the evaporation chamber.

show abstract

Section: Partially Ionized Vapormentioning

confidence: 99%

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

Volmer

Inga

Bißwanger

et al. 2021

J. Phys. D: Appl. Phys.

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show abstract

“…the ratio between the neutral and ionized vapor densities. 17,19,20 Especially at higher deposition rates, when a virtual source is created slightly above the actual crucible, 11,12 the amount of ionization increases, if the focus of the e-beam In an e-beam evaporator a hot filament emits electrons due to thermionic emission. These electrons are accelerated by a dc voltage V HV and focused onto the surface of the evaporation material by a magnetic field B.…”

Section: Types Of Particles and Radiation Emitted From An E-beam Evap...mentioning

confidence: 99%

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

Volmer,

Seidler,

Bisswanger

et al. 2020

Preprint

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We discuss how the emission of electrons and ions during electron-beam-induced physical vapor deposition can cause problems in micro-and nanofabrication processes. After giving a short overview of different types of radiation emitted from an electron-beam (e-beam) evaporator and how the amount of radiation depends on different deposition parameters and conditions, we highlight two phenomena in more detail: First, we discuss an unintentional shadow evaporation beneath the undercut of a resist layer caused by the one part of the metal vapor which got ionized by electron-impact ionization. These ions first lead to an unintentional build-up of charges on the sample, which in turn results in an electrostatic deflection of subsequently incoming ionized metal atoms towards the undercut of the resist. Second, we show how low-energy secondary electrons during the metallization process can cause cross-linking, blisters, and bubbles in the respective resist layer used for defining micro-and nanostructures in an e-beam lithography process. After the metal deposition, the crosslinked resist may lead to significant problems in the lift-off process and causes leftover residues on the device. We provide a troubleshooting guide on how to minimize these effects, which e.g. includes the correct alignment of the e-beam, the avoidance of contaminations in the crucible and, most importantly, the installation of deflector electrodes within the evaporation chamber.

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Investigation of the characteristics of ion saturation current in plasma over the keyhole in the process of electron beam welding

Слива

Kharitonov

Goncharov

et al. 2021

J. Phys.: Conf. Ser.

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The energy spectra of the ion saturation current of the Langmuir probe in the plasma formed over the keyhole directly during the process of electron-beam welding of steel 09G2S with the varied parameters (e.g., the welding speed and focus coil current) has been investigated. The presence of typical zones with the energy spectrum peaks in the low-frequency and high- frequency bands has been shown. It has been established that the peak location in the high- frequency range of the energy spectrum does not depend on the welding modes and the position of the probes relative to the keyhole. The low-frequency range of the energy spectrum depends on the vapor flow density of the keyhole and is rather sensitive to the welding modes. The use of electron beam oscillation makes it possible to control plasma flows and hydrodynamic processes in the penetration channel.

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Electron-Beam Atomic Spectroscopy for In Situ Measurements of Melt Composition for Refractory Metals: Analysis of Fundamental Physics and Plasma Models

Cited by 3 publications

References 30 publications

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

How to solve problems in micro- and nanofabrication caused by the emission of electrons and charged metal atoms during e-beam evaporation

Investigation of the characteristics of ion saturation current in plasma over the keyhole in the process of electron beam welding

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