Electronic Inventions and Discoveries Electronics from its Earliest Beginnings to the Present Day [Book Review]

Dummer, G.W.A.; Chakravarthi, P.

doi:10.1109/maes.1998.707563

Cited by 4 publications

(5 citation statements)

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“…DIP packaging was initially invented in the early 1960s to compensate the need for more signal supply and connectives in integrated circuits. Lifted or missing leads and solder bumps are the most significant defect types for DIP packaging [ 14 ]. In 1975, another type of electronic packaging is introduced—quad flat package or QFP.…”

Section: The Evolution Of Ic Packaging Related Defects and Currenmentioning

confidence: 99%

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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.

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Section: The Evolution Of Ic Packaging Related Defects and Currenmentioning

confidence: 99%

“…Flexibility in design, higher signal density with much smaller size are some of the advantages of the FCBGA packaging. FCBGA packages can be mounted on standard printed circuit boards [ 14 ]. Figure 1 schematically compares the wire bond BGA and FCBGA packaging with different parts marked.…”

Section: The Evolution Of Ic Packaging Related Defects and Currenmentioning

confidence: 99%

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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“…Historical records of inventions in computer technology show a disproportionate share of contributions from companies (see Dummer (1997) for a broader reconstruction covering all fields of electronic inventions and discoveries). At the same time, they open several windows onto the underlying dynamics of knowledge generated in academia.…”

Section: On the Origin Of Ideas In The It Industrymentioning

confidence: 99%

European competitiveness in information technology and long-term scientific performance

Bonaccorsi

2011

Sci. and Pub. Pol.

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The reasons behind the poor competitiveness of the European information technology (IT) industry visà-vis the US one have been discussed many times. This paper suggests that the long-term competitiveness of science-based industries is dependent on the ability of the underlying scientific base to support fast growing, turbulent and proliferating search regimes. This requires institutional mechanisms that foster severe selection of scholars from a large base, student and researcher mobility, and strong institutional complementarity with user industries. The paper compares the history of IT in the USA, Germany, the UK and France. Based on the analysis of the curriculum vitae of the top 1,000 scientists in computer science, it shows that these conditions were only met in the US academic system.

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“…Jordan en 1919 [Ecc19]. Primeramente se le denominó "circuito de disparo Eccles-Jordan" y fue en los comienzos de la era de los ordenadores, en la década de los cuarenta, cuando se le dio el nombre de flip-flop por el sonido que producía al conmutar de un estado a otro [Dum97].…”

Section: Flip-flops óPticos: Estado Del Arteunclassified

“…Este paso se dio a finales de los cuarenta cuando el Dr. John Von Neumann sugirió que las instrucciones de operación, así como los datos, se almacenaran de la misma manera en la "memoria" del ordenador [Dum97]. En este caso, el flip-flop también fue un elemento clave para el desarrollo de un tipo de memorias: las memorias de acceso aleatorio estáticas, más conocidas por sus siglas en inglés RAM (Random Access Memory).…”

Section: Flip-flops óPticos: Estado Del Arteunclassified

Flip-flops ópticos basados en interferómetros Mach-Zehnder activos con realimentación

Galindo¹

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Electronic Inventions and Discoveries Electronics from its Earliest Beginnings to the Present Day [Book Review]

Cited by 4 publications

References 0 publications

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

European competitiveness in information technology and long-term scientific performance

Flip-flops ópticos basados en interferómetros Mach-Zehnder activos con realimentación

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