Electronic Skin: Electronic Skin: Recent Progress and Future Prospects for Skin‐Attachable Devices for Health Monitoring, Robotics, and Prosthetics (Adv. Mater. 48/2019)

Yang, Jun; Mun, Je Ho; Kwon, Se Young; Park, Seongjun; Bao, Zhenan; Park, Steve

doi:10.1002/adma.201970337

Cited by 132 publications

(151 citation statements)

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“…Pressure sensors are playing an increasingly important role in a wide range of applications, from diagnostic health monitoring to precision surgery. [ 1–4 ] Next‐generation monitoring devices have been reported that use pressure sensors to detect biological signals associated with health status, including blood flow, [ 5–10 ] tendon repair, [ 11 ] activity levels, [ 12 ] intraocular glaucoma progression, [ 13 ] catheters, [ 14 ] electronic or artificial skin, [ 12,15–24 ] and point‐of‐care immunoassays. [ 25 ] For example, a recent paper from our group demonstrated that arterial‐pulse blood flow pressure sensors can be used for the early detection of failed vessel anastomosis—a surgical technique used to connect blood vessels—after complex reconstructive surgeries.…”

Section: Introductionmentioning

confidence: 99%

Microengineering Pressure Sensor Active Layers for Improved Performance

Ruth

Feig

Tran

et al. 2020

Adv Funct Materials

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379

277

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Pressure sensors play an integral role in a wide range of applications, such as soft robotics and health monitoring. In order to meet this demand, many groups microengineer the active layer-the layer that deforms under pressure and dictates changes in the output signal-of capacitive, resistive/piezoresistive, piezoelectric, and triboelectric pressure sensors in order to improve sensor performance. Geometric microengineering of the active layer has been shown to improve performance parameters such as sensitivity, dynamic range, limit of detection, and response and relaxation times. There are a wide range of implemented designs, including microdomes, micropyramids, lines or microridges, papillae, microspheres, micropores, and microcylinders, each offering different advantages for a particular application. It is important to compare the techniques by which the microengineered active layers are designed and fabricated as they may provide additional insights on compatibility and sensing range limits. To evaluate each fabrication method, it is critical to take into account the active layer uniformity, ease of fabrication, shape and size versatility and tunability, and scalability of both the device and the fabrication process. By better understanding how microengineering techniques and design compares, pressure sensors can be targetedly designed and implemented.

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Section: Introductionmentioning

confidence: 99%

Microengineering Pressure Sensor Active Layers for Improved Performance

Ruth

Feig

Tran

et al. 2020

Adv Funct Materials

Self Cite

379

277

View full text Add to dashboard Cite

show abstract

“…In addition to the basic functional modulates such as signal acquisition and processing by sensors and computation components, [19,23,975] the capability of short-range wireless communication is another essential aspect for future human-integrated devices, which could effectively transmit data to a portable platform like smartphones for real-time monitoring. [976,977] The continuous interaction between wearable sensors and portable smart platforms could enable long-term monitoring of vital signals from the human body.…”

Section: Wireless Communication Devicesmentioning

confidence: 99%

Ink‐Based Additive Nanomanufacturing of Functional Materials for Human‐Integrated Smart Wearables

2020

Advanced Intelligent Systems

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Human-integrated devices include wearable and implantable devices for monitoring vital human signals or interacting with the human body. [1-3] The human-integrated devices needed to be tethered to the organs or the human skin for implementing their functions such as sensing and energy harvesting. [4-18] The economical, agile, customizable manufacturing, and integration of multifunctional device modules into networked systems with mechanical compliance and robustness will enable unprecedented human-integrated smart wearables [19-23] and usher in exciting opportunities in emerging technologies such as electronics, [24-29] wearable computation, [30-36] human-machine interface, [37-42] robotics, [43-48] and advanced healthcare. [49-54] The fabrication of stateof-the-art microelectronics involves hightemperature processing steps, which are generally incompatible with the flexible substrates (e.g., paper, polymer, fiber, etc.) [55-61] widely used in the wearable devices. Moreover, the current microfabrication technologies are not well positioned to process the emerging functional nanomaterials (e.g., nanowires [NWs] and 2D materials). [62-65] Such incomparability severely limits the pace of deploying these emerging materials (despite their unprecedented properties) in wearable and flexible device technologies. The additive manufacturing (AM) processes have emerged as potential candidates for addressing the earlier limitations of the current microfabrication technologies in fabricating flexible/wearable printed devices with diversified functionalities, e.g., energy harvesting/storage, sensing, actuation, and computation, leveraging advantages such as maskless processing, versatile ink formulation, low cost, low processing temperature, and scalability. [66-71] Researchers have devoted tremendous efforts to develop the related technologies, and several reviews have provided excellent discussions on the material formulation and process aspects of AM techniques. [63,72-79] However, to our best knowledge, there are few review reports about the ink-based additive nanomanufacturing of functional materials for human-integrated smart wearables. To fill this gap, here we review the recent progress in ink-based

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“…There is growing interest in developing large-area flexible electronics for applications across numerous sectors, including wearables, robotics, consumer electronics, and healthcare [1][2][3][4][5][6]. Flexible electronics has several advantages such as conformability to different shapes, which make it indispensable for above application areas where electronic devices are needed on unconventional substrates to either conform to curvy surfaces or to degrade naturally [7][8][9][10][11][12][13][14][15][16][17][18][19][20]. Accordingly, significant research efforts are being made to develop electronic devices and systems with flexible form factors and novel manufacturing technologies [9,11,[21][22][23][24][25][26][27][28][29][30].…”

Section: Introductionmentioning

confidence: 99%

“…Flexible electronics has several advantages such as conformability to different shapes, which make it indispensable for above application areas where electronic devices are needed on unconventional substrates to either conform to curvy surfaces or to degrade naturally [ 7 – 20 ]. Accordingly, significant research efforts are being made to develop electronic devices and systems with flexible form factors and novel manufacturing technologies [ 9 , 11 , 21 – 30 ]. These range from integrating off-the-shelf electronic devices on flexible printed circuit boards to printing functional inks and materials to realise active devices and circuits [ 21 , 31 ].…”

Section: Introductionmentioning

confidence: 99%

High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

et al. 2020

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The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

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Electronic Skin: Electronic Skin: Recent Progress and Future Prospects for Skin‐Attachable Devices for Health Monitoring, Robotics, and Prosthetics (Adv. Mater. 48/2019)

Cited by 132 publications

References 0 publications

Microengineering Pressure Sensor Active Layers for Improved Performance

Microengineering Pressure Sensor Active Layers for Improved Performance

Ink‐Based Additive Nanomanufacturing of Functional Materials for Human‐Integrated Smart Wearables

High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

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