Electroplated Cu Micro Electrode for the Application in Micro Sinking Electro Discharge Machining (Micro-SEDM)

Abstract

Fabricating electrodes for Micro Sinking Electro Discharge Machining (Micro-SEDM) using thin-film technology is an attractive alternative to conventional processes. A lithography process taking advantage of a positive photoresist to create a micro mold for electroplating was optimized to reach a thickness in the order of 200 µm at a maximal structure aspect ratio of 10 (structure diameter 20 µm). The resist stability during the electroplating process was investigated. Sample micro Cu electrodes with a length of 167 µm could be deposited in micro mold with a maximal aspect ratio of 8. The paper provides simulation results for Cu and W micro electrodes, a fabrication process for the microelectrode mentioned above, as well as experimental investigations regarding their usage in a Micro-SEDM process.