2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2020
DOI: 10.1109/impact50485.2020.9268544
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Enabling MSL1 Zero Delamination through Advanced Packaging Solutions for Robust Automotive Power Package

April Joy Garete1,
Zhiwen Li2,
Arnel Taduran3
et al.
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Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package

Supramaniam
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Bakar
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Jalar
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2022
J Fail. Anal. and Preven.
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Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package

Supramaniam
1
,
Bakar
2
,
Jalar
3
2022
J Fail. Anal. and Preven.
2
0
0
0
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Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package

Supramaniam,
Bakar,
Atiqah
et al. 2023
J Fail. Anal. and Preven.
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Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device after Moisture Sensitivity Level 1

Li1,
Yip2,
Fung3
et al. 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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