2023
DOI: 10.1088/1674-1056/acc78f
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Enhanced mechanical and thermal properties of two-dimensional SiC and GeC with temperature and size dependence

Abstract: Two-dimensional materials with novel mechanical and thermal properties are available for sensors, photodetectors, thermoelectric, crystal diode and flexible nanodevices. In this investigation, the mechanical and thermal properties of pristine SiC and GeC are explored by molecular dynamics simulations. First, the fracture strength and fracture strain behaviors are addressed in the zigzag and armchair directions at 300 K. The excellent toughness of the SiC and GeC is obtained by the maximal fracture strain as 0.… Show more

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Cited by 7 publications
(10 citation statements)
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“…Obviously, the GBs can suppress the thermal conductivity of the pure SiC monolayer because the GBs can result in significant phonon scattering. 51 As shown in Figure 2b, an increase in the GBs angle leads to a more pronounced formation of pentagonheptagon defects, which is demonstrated in Figure S1 in the Supporting Information, further substantializing the reduction in the thermal conductivity of SiC GBs. Furthermore, the atomic heat flux vectors at angles of 5.09, 21.78, and 42.1°are calculated using J i = e i v i − S i v i , where e i , v i , and S i are atomic energy, the velocity vector consisting of v x , v y , and v z ; and the stress tensor consisting of S x , S y , S z , S xy , S xz , and S yz , respectively.…”
Section: ■ Results and Discussionmentioning
confidence: 84%
See 1 more Smart Citation
“…Obviously, the GBs can suppress the thermal conductivity of the pure SiC monolayer because the GBs can result in significant phonon scattering. 51 As shown in Figure 2b, an increase in the GBs angle leads to a more pronounced formation of pentagonheptagon defects, which is demonstrated in Figure S1 in the Supporting Information, further substantializing the reduction in the thermal conductivity of SiC GBs. Furthermore, the atomic heat flux vectors at angles of 5.09, 21.78, and 42.1°are calculated using J i = e i v i − S i v i , where e i , v i , and S i are atomic energy, the velocity vector consisting of v x , v y , and v z ; and the stress tensor consisting of S x , S y , S z , S xy , S xz , and S yz , respectively.…”
Section: ■ Results and Discussionmentioning
confidence: 84%
“…In our previous study, 51 we also explored the thermal properties of SiC monolayers using the NEMD method and such as Tersoff potential. The results were found to be consistent with the reported investigation, 52 suggesting the accuracy of the results of this work.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…In our study, LAMMPS 34–36 was employed to conduct equilibrium molecular dynamics (EMD) simulations 37 for the thermal conductivity of MOFs through the corrected heat flow calculation method, 38 which includes contributions from many-body potentials. The thermal conductivity was calculated using the equilibrium molecular dynamics simulations and the Green–Kubo formulation, 39 which is based on the fluctuation-dissipation theorem.…”
Section: Methodsmentioning
confidence: 99%
“…11 The revelation of graphene in 2004 marked a signicant turning point in materials research, 12 instigating a substantial fascination with 2D materials. [13][14][15][16][17][18] These materials offer numerous benets over traditional materials, such as a modiable bandgap, 19,20 a con-siderable specic surface area, 21 and distinctive photoelectric properties that conventional materials lack. 22,23 These remark-able pro-perties have opened up a new prospect for exploring photocatalysts.…”
Section: Introductionmentioning
confidence: 99%