2021
DOI: 10.1016/j.triboint.2020.106816
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Enhanced surface hardness and tribocorrosion performance of 60NiTi by boron ion implantation and post-annealing

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Cited by 34 publications
(14 citation statements)
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“…Here, minimal hardness values corresponded to the matrix material and maximum values corresponded to large titanium diboride particles with sizes from 5 to 9.5 µm. Average microhardness value was 8 GPa, which is 1.5–2.6-times higher than the average microhardness value for pure alloys based on nickel and titanium as well as heavy alloys based on tungsten [ 23 , 24 , 25 ]. Increases in the microhardness of NiTi-TiB 2 samples obtained by high-temperature vacuum sintering are related to high hardness of titanium diboride (25–35 GPa) [ 26 ].…”
Section: Resultsmentioning
confidence: 76%
“…Here, minimal hardness values corresponded to the matrix material and maximum values corresponded to large titanium diboride particles with sizes from 5 to 9.5 µm. Average microhardness value was 8 GPa, which is 1.5–2.6-times higher than the average microhardness value for pure alloys based on nickel and titanium as well as heavy alloys based on tungsten [ 23 , 24 , 25 ]. Increases in the microhardness of NiTi-TiB 2 samples obtained by high-temperature vacuum sintering are related to high hardness of titanium diboride (25–35 GPa) [ 26 ].…”
Section: Resultsmentioning
confidence: 76%
“…In the practice of ion implantation, the increasing atomic displacements generally result in the increase of compressive stress at the surface of the target. [40,41] Thereby, there would be no sufficient surface compressive stress for the LLZTO and LLZTO-L samples, and the improved lifespan of LLZTO-M and LLZTO-H samples could be attributed to the ion implantation induced surface compressive stress. However, excessive ion implantation dose above the amorphization threshold value could lead to glass transition or complete amorphization of the target material.…”
Section: Resultsmentioning
confidence: 99%
“…This alteration of the performance of optical devices is larger than the typical variation brought about by fabrication errors, therefore allowing for correction or 'trimming' of such devices. The annealing process, also widely reported, is the mechanism utilised in removing the lattice defects created by implantation [65][66][67][68]. We used the annealing technique here to tune the performance of implanted optical devices for different applications, including wafer-scale testing, post-fabrication trimming, and programmable photonic circuits.…”
Section: Applications and Discussionmentioning
confidence: 99%