Enhancing Bi2Te2.70Se0.30 Thermoelectric Module Performance through COMSOL Simulations

Abstract

This research employs the COMSOL Multiphysics software (COMSOL 6.2) to conduct rigorous simulations and assess the performance of a thermoelectric module (TEM) meticulously crafted with alumina (Al2O3), copper (Cu), and Bi2Te2.70Se0.30 thermoelectric (TE) materials. The specific focus is on evaluating diverse aspects of the Bi2Te2.70Se0.30 thermoelectric generator (TEG). The TEM design incorporates Bi2Te2.70Se0.30 for TE legs of the p- and n-type positioned among the Cu layers, Cu as the electrical conductor, and Al2O3 serving as an electrical insulator between the top and bottom layers. A thorough investigation is conducted into critical parameters within the TEM, which include arc length, electric potential, normalized current density, temperature gradient, total heat source, and total net energy rate. The geometric configuration of the square-shaped Bi2Te2.70Se0.30 TEM, measuring 1 mm × 1 mm × 2.5 mm with a 0.25 mm Al2O3 thickness and a 0.125 mm Cu thickness, is scrutinized. This study delves into the transport phenomena of TE devices, exploring the impacts of the Seebeck coefficient (S), thermal conductivity (k), and electrical conductivity (σ) on the temperature differential across the leg geometry. Modeling studies underscore the substantial influence of S = ±2.41 × 10−3 V/K, revealing improved thermal conductivity and decreased electrical conductivity at lower temperatures. The findings highlight the Bi2Te2.70Se0.30 TEM’s high potential for TEG applications, offering valuable insights into design and performance considerations crucial for advancing TE technology.