Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating

Kumaravel, Dinesh Kumar; Durai, Kevin Antony Jesu; Nair, Shyam M; Nair, Shinoj S; Yu, Hailey Huijun; Alptekin, John; Chyan, Oliver M.R.; Mathew, Varughese

doi:10.1109/ectc51529.2024.00194

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00194

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Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating

Dinesh Kumar Kumaravel,

Kevin Antony Jesu Durai,

Shyam M Nair

et al.

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Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating

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References 25 publications

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