2024 28th International Conference on Information Technology (IT) 2024
DOI: 10.1109/it61232.2024.10475757
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Enhancing Electrical and Physical Properties of Epoxy Resin by Incorporating SiO₂ Nano Filler

Eid J. Eid,
Ahmed Hossam-Eldin,
Loai S. Eldeen
et al.
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