Enhancing thermal conductivity of polyimide composite film by electrostatic self-assembly and two-step synergism of Al₂O₃ microspheres and BN nanosheets

Abstract

A strategy of electrostatic self-assembly and two-step synergism was proposed to significantly improve the thermal conductivity of the PI composite film.

Research progress of high thermal conductivity polyimide dielectric films

“…此外, 形状相同但粒径不同的填料混合, 可以优化填料的 填充密度, 小尺寸的填料填充到大尺寸填料的空隙 中, 增加形成导热路径的可能性. 相同类型但形状 和尺寸不同的填料也可发挥填料之间的协同作用 [90] . 2D的混合填料组成, 单网络示意图如图12所示 [86] .…”

High Out-of-Plane Thermally Conductive Polyimide Film for Electronic Thermal Management by the Incorporation of Core–Shell Ag/Polyimide Microparticles

“…Considering that heat is transferred in all directions, a substantial enhancement of the out-of-plane thermal conductivity of PI films is desired. Currently, many strategies have been employed to upgrade the out-of-plane thermal conductivity of PI films, such as chemical vapor deposition, templates, external field induction, and the preparation of isotropic thermally conductive fillers. ,− Among these strategies, because of the simple and large-scale feature, isotropic thermally conductive fillers exhibit a huge potential in industrial applications. Duan et al reported a PI composite film with BN nanosheet-coated Al 2 O 3 microspheres (Al 2 O 3 @BN) as isotropic thermally conductive fillers.…”

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

“…The electrically conductive properties of most carbon-based materials hinder their thermal management applications in the field of electronic insulation. Thus far, the thermally conductive and insulating fillers that have been mainly studied and applied are boron nitride (BN), [14][15][16][17][18][19] alumina (Al 2 O 3 ), 20,21 and nanodiamond (ND). [22][23][24] The intrinsic thermal conductivity of hexagonal boron nitride (h-BN) and Al 2 O 3 are insufficient, while the application of boron nitride nanosheets (BNNSs) with their high thermal conductivity is problematic because of their high cost and resultant agglomeration.…”