Etching Depthvariation of Brass Material for Different Operating Conditions

Abstract

The conventional machining deals with the removal of metal by direct contact between the tool and the work piece, which results into the formation of chips, debris etc. So, there is scope for unconventional machining process like PCM. This paper focuses on study of Depth of etching in photochemical machining by varying temperature and time of etching. The objective is to study the effect of these parameters and find relation between them. This process is the bridge between 2D and 3D manufacturing processes. Initially the photo-tools are prepared; Brass material was taken for experimentation. The control parameters were temperature, concentration and time. The concentration of etchant (FeCl 3) was 781 grams per liter. The temperature and time are varying parameters for etching. The readings are taken by Digital Micro-meter. A pattern may be transferred onto a photoresist film by exposing the photoresist to light through a mask of the pattern called photo-tool and obtain pattern on metal.