2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2024
DOI: 10.1109/itherm55375.2024.10709555
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Evaluating the Efficiency of Machine Learning Approaches for Predicting Solder Joint Characteristic Life under Isothermal Aging and Thermal Cycling Test Conditions

Soroosh Alavi,
Daniel Silva,
Palash Pranav Vyas
et al.
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