The Proceedings of Conference of Kanto Branch
 2020
DOI: 10.1299/jsmekanto.2020.17a05
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Evaluation of Adhesion between Sputtered Copper Thin Film and Poly （etheretherketone） （PEEK） Substrate Modified by Exposure of Active Oxygen Species and Ultraviolet Light

Hiromi Yamanaka
1
,
Munenori Yoshida
2
,
Kazuki Hosoya
3
et al.
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