Evaluation of plasma process damage during TSV formation and damage reduction method

Igarashi, Tomoyuki; Kojima, Kazuyoshi; Matsumoto, Kazuya; Fujimori, Noriyuki; Nakamura, Tsutomu

doi:10.1109/icep-iaac.2015.7111004

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Evaluation of plasma process damage during TSV formation and damage reduction method

Cited by 2 publications

References 2 publications

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

Influence of surface properties on adhesion strength of dielectric passivation in chip size packaging

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