Evaluation of response characteristics of thin film gauge for conductive heat transfer mode

Abstract

Heat transfer analysis is the one of the most important designing aspects for many engineering systems. The design prospect in the preview of heat transfer focuses on the prediction of heat flux with the help of measured transient temperature data. Thin film gauges are one of the most predominant method for the heat flux prediction especially for short duration transient temperature measurement. Thin film gauges are usually exposed to the heated environment for the measurement purpose. However, there are some prominent research areas like ablation phenomenon met to spacecraft thermal shields during re-entry to the atmosphere, for which direct exposure of the thin film gauge to the heated environment causes the functional and working difficulties associated with the gauge. In the present study, it is aimed to investigate the suitability of thin film gauge for the conduction-based short duration measurement. An experimental set up is fabricated, which is used to supply the heat load to the hand-made thin film gauge using platinum as sensing element and quartz as a substrate. The transient temperature data is recorded during experiment is further compared with the simulated temperature histories obtained through finite element analysis. The heat flux estimation for both the analysis is made using measured transient temperature data by convolute integral of one- dimensional heat conduction equation. The estimated heat flux value for the experimental and numerical result is found to be in excellent agreement.