2015
DOI: 10.1016/j.resconrec.2015.08.009
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Evolution and present status of silicon carbide slurry recovery in silicon wire sawing

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Cited by 32 publications
(5 citation statements)
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“…Mc-Si solar cells, as one of the main products for solar photovoltaic applications, have a substrate of mc-Si wafers that can be obtained by processing by wire saw [3]. Earlier, the processing method for silicon ingot cutting was mainly slurry wire saw (SWS) [4,5]. The surface morphology of the mc-Si wafer obtained by this process shows that pits are uniformly distributed on the wafer surface, which facilitates subsequent etching using wet acid etching process [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…Mc-Si solar cells, as one of the main products for solar photovoltaic applications, have a substrate of mc-Si wafers that can be obtained by processing by wire saw [3]. Earlier, the processing method for silicon ingot cutting was mainly slurry wire saw (SWS) [4,5]. The surface morphology of the mc-Si wafer obtained by this process shows that pits are uniformly distributed on the wafer surface, which facilitates subsequent etching using wet acid etching process [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…Particles Si, SiC and Fe form a stable suspension in PEG, and the Si/SiC powder particles possess overlapping size ranges and similar physicochemical properties. This makes it difficult to separate and recycle Si and SiC powders from SSW . A promising approach is to recycle Si and SiC powders together and use them to prepare high-added-value materials such as SiC whiskers.…”
Section: Introductionmentioning
confidence: 99%
“…This makes it difficult to separate and recycle Si and SiC powders from SSW. 18 A promising approach is to recycle Si and SiC powders together and use them to prepare high-added-value materials such as SiC whiskers. However, there are no existing reports on the preparation of SiC whiskers using SSW as the silicon source.…”
Section: ■ Introductionmentioning
confidence: 99%
“…PEG is collected by dehydrating or distilling the liquid after solid-liquid separation of cutting slurry. Afterwards, the solid is dissolved in acid to remove iron and Si, SiC fine powder is left behind [3][4][5][6][7]. The recovery of crystalline Si is still a challenge.…”
Section: Introductionmentioning
confidence: 99%