Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests

Ong, Jia-Juen; Tran, Dinh-Phuc; Huang, Hua-Jing; Chiu, Wei-Lan; Yang, Shih-Chi; Wu, Wen-Wei; Chiang, Hsiang-Hung; Chen, Chih

doi:10.1016/j.jmrt.2024.12.037

Journal of Materials Research and Technology

2024

DOI: 10.1016/j.jmrt.2024.12.037

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Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests

Jia-Juen Ong,

Dinh-Phuc Tran,

Hua-Jing Huang

et al.

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Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests

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References 36 publications

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