2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems 2013
DOI: 10.1109/transducers.2013.6626965
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Excluding grain boudaries from thin Si film MEMS/NEMS devices

Takashi Tomikawa
1
,
Shinya Kumagai
2
,
Ichiro Yamashita
3
et al.
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