Experiments with Miniature Wire EDM for Silicon

Kane, Makarand M.; Tiwari, Nitin; Joshi, Kamlesh; Kulkarni, S.D.; Bahirat, Himanshu J.; Joshi, Suhas S.

doi:10.1016/j.procir.2020.01.203

Cited by 2 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A brief explanation of the pulse generator's operation is provided, along with a circuit schematic that illustrates its topology. [33] Gurusamy Selvakumaret al, are presented The research examines the topic of investigating corner correctness in AISI D3 tool steel wire cut EDM. The tool and die producing industries use AISI D3 steel extensively.…”

Section: Fabrication Methodsmentioning

confidence: 99%

Recent Research in Wire Cut Electrical Discharge Machining Process

2024

jmc

View full text Add to dashboard Cite

A product's shape and size are developed through the manufacturing process, which is essential to all sectors. With its unique thermal machining technique, Wire Cut Electrical Discharge Machining (WEDM), items with sharp edges and varied hardness that prove challenging to produce using conventional machining methods can be precisely machined. Utilizing the widely used non-contact material removal technique, the practical technology of the WEDM process is based on the typical EDM sparking phenomenon. When the process was first introduced, WEDM has developed from a crude way to make tools and dies to the best way to produce micro-scale parts with the highest level of surface finish quality and dimensional accuracy. This paper reviews the extensive amount of research done from the EDM process to the development of the WEDM. It reports on the WEDM research that involves optimizing the process parameters and examining the impact of various factors on productivity and machining performance. The impact of multiple WEDM process input parameters, including wire speed, peak current, pulse on and off times, and peak on material removal rate (MRR), surface roughness (Ra), and micro structural analysis, on various process output responses is reviewed in this study.

show abstract

Section: Fabrication Methodsmentioning

confidence: 99%

Recent Research in Wire Cut Electrical Discharge Machining Process

2024

jmc

View full text Add to dashboard Cite

show abstract

“…Presently, the wire saw is one of the most frequently used wafering method. 3 The wire saw methods are of two types, fixed and loose abrasive wire saw. 4 The loose abrasive wire saw method utilizes abrasive slurry to remove the material, 5 whereas in fixed abrasive wire saw method uses a stainless steel wire with diamond abrasives embedded on it.…”

Section: Introductionmentioning

confidence: 99%

Investigation and multi-objective optimization of monocrystalline silicon wafering using wire electro-discharge machining

Verma

Singh

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

Monocrystalline silicon wafers are widely used as the primary material for solar cell production in the photovoltaic industry, owing to their high efficiency and sleeker aesthetic. Wafering is the primary process towards wafer production. The existing wafering processes have limitations of cracking, chipping, and high kerf loss, arising the need for cost-efficient and precise methods to produce wafers. In the present experimental work, an attempt has been made to explore the potential of Wire Electro-discharge Machining (WEDM) for wafer production and to gain an understanding of the effects caused by pulse on time (Ton), pulse off time (Toff), peak current (Ip), wire tension (WT), and wire feed rate (WFR) during the wafering process to achieve the optimal parametric setting for attaining maximum wafering speed and minimum surface roughness. The work material used was P-type monocrystalline silicon. Wafers thickness of 250 μm was produced, avoiding edge chipping. The experimentation was planned according to the face-centered central composite design. The obtained results were statistically analyzed, and response surface methodology (RSM) was used to model the wafering speed and surface roughness. From the analysis of experimental results, it was noticed that at the higher level of Ton and Ip, a maximum wafering speed of 2.574 mm/min was attained. In contrast, the minimum surface roughness of 1.57 μm was achieved at the lower level of Ton and Ip. The most significant process variables that influence the wafering speed and surface roughness are the Ton, Toff, and Ip. Micrographs of the wafer surface reveal the presence of micro craters, but there was no evidence of micro-cracks. The multi-objective optimization of the responses was done using the desirability approach, and the optimized values of wafering speed and surface roughness attained were 0.989 mm/min and 1.57 μm, respectively.

show abstract

Experiments with Miniature Wire EDM for Silicon

Cited by 2 publications

References 9 publications

Recent Research in Wire Cut Electrical Discharge Machining Process

Recent Research in Wire Cut Electrical Discharge Machining Process

Investigation and multi-objective optimization of monocrystalline silicon wafering using wire electro-discharge machining

Contact Info

Product

Resources

About