2023 IEEE Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMC+SIPI) 2023
DOI: 10.1109/emcsipi50001.2023.10241691
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Extraction for Multilayer Ceramic Capacitor Vibration Induced Force

Yifan Ding,
Jianmin Zhang,
Mingfeng Xue
et al.
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Cited by 4 publications
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Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations

Ding,
Xue,
Zhang
et al. 2024
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal &Amp;amp; Power Integrity (EMC+SIPI)
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Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations

Ding,
Xue,
Zhang
et al. 2024
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal &Amp;amp; Power Integrity (EMC+SIPI)
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On Finding an Equivalent Force to Mimic the Multilayer Ceramic Capacitor Vibration

Ding,
Zhang,
Xue
et al. 2023
2023 IEEE Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMC+SIPI)
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Equivalent Source Investigation for PCB Vibration Excited by a Multilayer Ceramic Capacitor

Ding,
Xue,
Zhang
et al. 2024
IEEE Trans. Electromagn. Compat.
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