2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM 2023
DOI: 10.1109/iitc/mam57687.2023.10154689
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Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device

Junki Jang
1
,
K.-C. Park
2
,
Chibeom Park
3
et al.
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