2022
DOI: 10.1007/s11696-022-02237-6
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Fabrication of stable ZnO/Zn–Al/Al2O3 superhydrophobic material on aluminum substrate for high photocatalytic and antibacterial activity

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Cited by 6 publications
(4 citation statements)
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“…Eqn (5) represents the reaction, which takes place a little after etching. During this interval, the deposition reaction of Ag + solution with the copper substrate results in the formation of Ag 0 particles on the copper substrate surface, which is designated in eqn (6). Eventually, the CuO and AgO formed during the chemical reactions due to thermal annealing are represented in eqn ( 7) and ( 8), also supported by XRD.…”
Section: (G)mentioning
confidence: 87%
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“…Eqn (5) represents the reaction, which takes place a little after etching. During this interval, the deposition reaction of Ag + solution with the copper substrate results in the formation of Ag 0 particles on the copper substrate surface, which is designated in eqn (6). Eventually, the CuO and AgO formed during the chemical reactions due to thermal annealing are represented in eqn ( 7) and ( 8), also supported by XRD.…”
Section: (G)mentioning
confidence: 87%
“…It has been practically observed and believed that the greater the value of E corr and the lower the I corr , then anti-corrosion phenomena will be higher. 6 The efficiency of corrosion resistance of the non-coated and coated copper alloy was calculated by following the expression given below.…”
Section: Corrosion Resistancementioning
confidence: 99%
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