Failure analysis of electronic components after long-term storage

Yong, Zhao; Fu, Guicui

doi:10.1016/j.engfailanal.2014.10.014

Cited by 9 publications

(1 citation statement)

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“…The optical microscopic investigation is a powerful tool for the evaluation of electronic assemblies and is the most frequently applied analysis technique (Balogh et al 2006 ; Castello et al 2006 ; Reiter et al 2002 ). It can be used to detect nonconformities on electronic assemblies and for the documentation of the samples as received (Balogh et al 2008a , b ; Nagynemedi et al 2009 ; Smith 2007 ; Zhao and Fu 2015 ). After documentation, the physical appearance of the defect has to be evaluated.…”

Section: Introductionmentioning

confidence: 99%

Applying microscopic analytic techniques for failure analysis in electronic assemblies

Grosshardt¹,

Nagy²,

Laetsch

2019

Appl. Microsc.

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The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.

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