2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2021
DOI: 10.1109/itherm51669.2021.9503257
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Fatigue Performance of Ball Grid Array Components at Elevated Temperature

Xin Wei
1
,
Minghong Jian
2
,
Mohamed El Amine Belhadi
3
et al.
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Cited by 6 publications
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References 45 publications
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Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints

Mondal
1
,
Haq
2
,
Suhling
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
3
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Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints

Mondal
1
,
Haq
2
,
Suhling
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
3
0
0
0
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Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles

Hasan
1
,
Ahsan
2
,
Suhling
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles

Hasan
1
,
Ahsan
2
,
Suhling
3
et al. 2022
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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