Fiber-coupled photonic interconnects based on stacked glass block connectors

Zamora, Vanessa; Schröder, Henning; Marx, Sebastian; Herter, Jonas; Brauda, Daniel; Lewoczko‐Adamczyk, Wojciech; Schuster, Martin

doi:10.1117/12.2514807

Cited by 1 publication

(1 citation statement)

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“…For this conversion, custommade additional optical SSC chips with integrated waveguides for increasing mode field diameters to around 10 μm are available, fabricated using glass by ion exchange [34][35][36] or fs-laser writing. 37 Tapered structures are employed here, including silicon photonics. 38 These additional chips typically have more than one waveguide, enabling not only single, but also multiple coupling with mostly 250-or 125-μm pitches.…”

Section: Introductionmentioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

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Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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