SYNOPSISThe Iosipescu shear test method, adapted for adhesives, was used to evaluate shear stressstrain properties of five epoxy-based film adhesives. The shear strength of some adhesives, determined by this technique, was found to differ greatly from that determined by either lap shear and/or thick adherend tests. Accurate measurements of the adhesive bond-line deformation enabled evaluation of the adhesive elastic and plastic properties as well as the calculation of shear modulus. A high-speed video camera was employed to augment observation on the joint deformation.