Fill Sealing Material Removal in Electronic Components Using Laser Cutting

Abstract

To ensure the normal operation of the electronic components, packaging technology is widely used in the production process of semiconductors, such as stand-alone device, LSI, super LSI, etc. This approach makes a lot of wasted components stay intact and reused. This paper uses laser cutting technology to remove material from PCB resin potting material, establishes the mathematical model of electronic potting materials, designs precision CNC laser cutting equipment for removing potting material under different circumstance. Using precision laser cutting technique, the resin potting material of waste PCB circuit can be removed, so as to expose entirely electronic components and all the solder joints. The technology has high economic benefit by ensuring electronic component function intact for reuse and improving the utilization rate of resource.