Finite Element Analysis of Diamond Wire Saw Slicing SiCp-Al Composites

Abstract

In order to study the physical nature and basic rule of diamond wire saw slicing SiCp-Al composites, the slicing mechanism was studied in theory first. There are different ways of slicing Al and SiC particles respectively: Al is sliced in plastic way and SiC particles are sliced in brittle ways such as being cut off or pulled out or pressed into matrix or burst. Then based on the finite element software Abaqus, the process of diamond wire saw slicing SiCp-Al composites was simulated. The distribution of internal stress and surface topography was discussed: The internal stress in SiC particles is far high than that in Al. The surface topography of sliced SiCp-Al composites is determined by SiC particles states mainly. The research results provide reference and guidance to the optimization of actual process of diamond wire saw slicing SiCp-Al composites.