2020
DOI: 10.1016/j.ijheatmasstransfer.2020.120021
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Flat miniature heat pipe with sintered porous wick structure: experimental and mathematical studies

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Cited by 18 publications
(2 citation statements)
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“…Devices made of silicon carbide or gallium nitride have been developed, with chip element sizes reaching . In these specific cases, heat flux densities in a range of are achieved for surface areas as small as and for [ 2 , 12 , 13 , 14 , 15 ]. In the case of FMHP [ 2 ], for copper-water coupling, heat fluxes of the order of 40 W/cm 2 applied to the evaporator wall in a vertical position can be achieved.…”
Section: Introductionmentioning
confidence: 99%
“…Devices made of silicon carbide or gallium nitride have been developed, with chip element sizes reaching . In these specific cases, heat flux densities in a range of are achieved for surface areas as small as and for [ 2 , 12 , 13 , 14 , 15 ]. In the case of FMHP [ 2 ], for copper-water coupling, heat fluxes of the order of 40 W/cm 2 applied to the evaporator wall in a vertical position can be achieved.…”
Section: Introductionmentioning
confidence: 99%
“…Insulated substrates with single anisotropic layer were analyzed in [26], having sources and sinks on both sides, neglecting the heat sink convective plane. As further complication, the authors in [11,27,28,29] included a vapour chamber in between isotropic laminates, in order to passively spread the heat by promoting two-phase recirculation based on capillary force pumping. Moreover, once the temperature distribution is known in the source plane as the solution of the Laplace's heat equation, a prediction for the total resistance connected to each component can be obtained.…”
Section: Introductionmentioning
confidence: 99%