Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres

Huynh, Van Long; Aasmundtveit, Knut E.; Nguyen, Hoang-Vu

doi:10.23919/empc55870.2023.10418295

2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2023

DOI: 10.23919/empc55870.2023.10418295

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Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres

Van Long Huynh,

Knut E. Aasmundtveit,

Hoang-Vu Nguyen

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Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres

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References 17 publications

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