Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly

Kim, Dongjin; Han, Seonghui; Han, Sang Eun; Choi, Dong-Gyu; Chung, Kwansik; Kim, Eunchae; Yoo, Sehoon

doi:10.1109/impact63555.2024.10818907

2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2024

DOI: 10.1109/impact63555.2024.10818907

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Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly

Dongjin Kim,

Seonghui Han,

Sang Eun Han

et al.

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Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly

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