2018
DOI: 10.1002/adma.201802211
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Folding 2D Structures into 3D Configurations at the Micro/Nanoscale: Principles, Techniques, and Applications

Abstract: configurations are no longer sufficient, either in terms of realizing certain crucial functionalities or in performance improvement. Compared to 2D structures, 3D structures have one more dimension, which enables more diversity in structure/ device design and is crucial in realizing richer physical interactions, better performance, and advanced functionalities. For example, to obtain a negative permeability from split ring resonators (SRRs) to construct negative index metamaterial, a vertical configuration of … Show more

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Cited by 45 publications
(34 citation statements)
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“…shows the normalized deflections as functions of the thickness ratio for bending (solid lines) and folding (dashed lines), respectively, under 4 6 10 B − = . As the thickness ratio Tc/Tf increases, both bending and folding deflections increase, but the bending deflection reaches a plateau.…”
Section: Figure 1ementioning
confidence: 99%
“…shows the normalized deflections as functions of the thickness ratio for bending (solid lines) and folding (dashed lines), respectively, under 4 6 10 B − = . As the thickness ratio Tc/Tf increases, both bending and folding deflections increase, but the bending deflection reaches a plateau.…”
Section: Figure 1ementioning
confidence: 99%
“…Micromachines 2020, 11, x FOR PEER REVIEW 3 of 15 capability of bending suspended thin films of various materials in both directions (−70-90°) precisely by controlling the ion dose and irradiation area of FIB and, the deformation might be caused by the stress change in the films under FIB irradiation [28]. The FIB-SID technique is a newly developed method to fabricate complex 3D micro/nanostructures [29][30][31][32][33], which can be used in optical modulation, controllable drug delivery, cell capsulation, and many other areas [34]. Compared to other 3D nanostructure array fabrication methods, the FIB-SID technique can process, in real-time, complex 3D structures with nanoscale precision and is versatile for diverse materials [28,35].…”
Section: D Meta-atom Structure Design and Unfolding Pattern Figurementioning
confidence: 99%
“…In contrast, while the integration and assembly of inherently 2D and stacked devices are relatively facile at small size scales, i.e., below about 1 mm, using very large scale integration (VLSI) processes, it is extremely challenging to fabricate and assemble nonplanar, curved, and angled 3D structures with dissimilar materials. The challenge is rooted in several fundamental material and engineering constraints that are encountered at small size scales . For example, due to large surface area‐to‐volume ratios, surface roughness, trapped charges, and local condensation, stiction increases significantly.…”
Section: Introductionmentioning
confidence: 99%