Formation of Supersaturated Solid Solutions Bi-Ag and Bi-Zn by Rapid Solidification Using Melt Spinning Technique

El-Ashram, Tarek

doi:10.4236/msa.2015.62021

Cited by 4 publications

(3 citation statements)

References 15 publications

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“…In addition, the structure of pure metals or alloys rapidly solidified from the melt is always unusual in some respect, even if the phases present have the same crystal structure as in the equilibrium pure metals or alloys. Recently, it was found that rapid solidification can produce semiconductors directly in some alloy systems [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Rapidly Solidified Melt-spun Bi-Sn Ribbons: Surface Composition Issues

Ashram

Carapeto

Rego

2016

JAP

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Tin-bismuth alloy ribbons were produced using melt-spinning technique. The two main surfaces (in contact with the rotating wheel and exposed to the air) were characterized with Optical Microscopy and AFM, revealing that the surface exposed to the air is duller (due to a long-range heterogeneity) than the opposite surface. Also the XPS chemical composition revealed many differences between them both on the corrosion extension and on the total relative amounts of tin and bismuth. For instance, for the specific case of an alloy with a composition Bi-4 wt % Sn, the XPS atomic ratios Sn/Bi are 1.1 and 3.7 for the surface in contact with the rotating wheel and for the one exposed to air, respectively, showing, additionally, that a large segregation of tin at the surface exists (nominal ratio should be 0.073). This segregation was interpreted as the result of the electrochemical process yielding the corrosion products.

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Section: Introductionmentioning

confidence: 99%

Rapidly Solidified Melt-spun Bi-Sn Ribbons: Surface Composition Issues

Ashram

Carapeto

Rego

2016

JAP

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“…Other investigated alloys are from the Bi-Ag, Bi-Sb, Bi-Sn, Bi-Zn, or Bi-Sn-Zn systems, where further investigations are necessary for better understanding. The addition of Bi decreases the melting point of the system and improves the wettability, and up to a certain extent, the mechanical properties could also be improved [7,[17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Assessment of Molten Bix-Sn1−x (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys

Niculescu,

Pencea,

Iacob

et al. 2024

Materials

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Properties such as lower melting temperature, good tensile strength, good reliability, and well creep resistance, together with low production cost, make the system Bi-Sn an ideal candidate for fine soldering in applications such as reballing or reflow. The first objective of the work was to determine the thermodynamic quantities of Bi and Sn using the electromotive force measurement method in an electrolytic cell (Gibbs’ enthalpies of the mixture, integral molar entropies, and the integral molar excess entropies were determined) at temperatures of 600 K and 903 K. The second objective addressed is the comprehensive characterization of three alloy compositions that were selected and elaborated, namely Bi25Sn75, Bi50Sn50, and Bi75Sn25, and morphological and structural investigations were carried out on them. Optical microscopy and SEM-EDS characterization revealed significant changes in the structure of the elaborated alloys, with all phases being uniformly distributed in the Bi50Sn50 and Bi75Sn25 alloys. These observations were confirmed by XRD and EDP-XRFS analyses. Diffractometric analysis reveals the prevalence of metallic Bi and traces of Sn, the formation of the Sn0.3Bi0.7, Sn0.95Bi0.05 compounds, and SnO and SnO2 phases.

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“…The solute atoms play an important role in formation of semiconductors by rapid solidification. In this respect, a series of rapidly solidified Bi based semiconductor alloys were produced using melt spinning technique [2]- [4]. They found that the semiconducting behavior depended on the type of the solute atoms added to Bi.…”

Section: Introductionmentioning

confidence: 99%

The Role of Silver Additions in Formation of Sn-Bi-Ag Semiconductor Alloys by Rapid Solidification

Ashram¹

2015

MSA

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Five alloys Sn-5Bi-xAg (x = 0, 1, 2, 3, and 4 in at %) are produced by rapid solidification using melt-spinning technique. From temperature dependence of electrical resistivity (TDR), it is found that the Sn-5Bi-xAg (x = 1, 2, 3, 4 in at %) rapidly solidified by melt spinning technique are narrow band semiconductor alloys. The energy gap Eg decreases by increasing Ag concentration from 203 meV for Sn-5Bi-1Ag to 97.5 meV for Sn-5Bi-4Ag alloy. From x-ray diffraction analysis (XRD), it is found that the Hume-Rothery condition for phase stability is not satisfied for this alloy.

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Formation of Supersaturated Solid Solutions Bi-Ag and Bi-Zn by Rapid Solidification Using Melt Spinning Technique

Cited by 4 publications

References 15 publications

Rapidly Solidified Melt-spun Bi-Sn Ribbons: Surface Composition Issues

Rapidly Solidified Melt-spun Bi-Sn Ribbons: Surface Composition Issues

Thermodynamic Assessment of Molten Bix-Sn1−x (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys

The Role of Silver Additions in Formation of Sn-Bi-Ag Semiconductor Alloys by Rapid Solidification

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