Conference on Lasers and Electro-Optics 2022
DOI: 10.1364/cleo_si.2022.sf2k.3
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Free-Form Micro-Optical Reflectors for Broadband and Low-Loss Fiber-to-Chip Coupling

Abstract: We demonstrate a novel fiber-to-chip coupling scheme based on surface-normal free-form micro-reflectors 3D-printed onto SiNx waveguide facets. Insertion losses of 0.5 dB and 1 dB bandwidth exceeding 300 nm were measured at 1550 nm wavelength.

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Cited by 4 publications
(4 citation statements)
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“…In addition to the four main metrics, manufacturability, scalability, and compatibility with standard electronic packaging protocols (e.g., solder thermal reflow treatment) are among other considerations that should be accounted for. Figure presents a radar chart comparing several optical coupling technologies based on these metrics.…”
Section: Optical Coupling Interfacementioning
confidence: 99%
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“…In addition to the four main metrics, manufacturability, scalability, and compatibility with standard electronic packaging protocols (e.g., solder thermal reflow treatment) are among other considerations that should be accounted for. Figure presents a radar chart comparing several optical coupling technologies based on these metrics.…”
Section: Optical Coupling Interfacementioning
confidence: 99%
“…However, as they still suffer from shoreline density problem, future connectors will be designed to be compatible with surface mount technology (SMT) packaging, thereby leveraging the economy of scale in standard electronics packaging. Besides refractive microlenses, reflective micro-optics can be similarly adapted for this purpose. , …”
Section: Packaging Considerations For Emerging Applicationsmentioning
confidence: 99%
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