2010
DOI: 10.1149/1.3501034
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From 2D Lithography to 3D Patterning

Abstract: IntroductionThe trend to further integrate and miniaturize electronic systems generates the need to improve the diverse manufacturing technologies for heterogeneous integration, 3-Dimensional (3D) integration, advanced wafer level packaging (WLP) etc. Lithography is a key technology in down scaling and tools like wafersteppers, originally developed for early CMOS downscaling are nowadays integrated in the 3D process lines. The application of wafersteppers for 3D process integration does not require the ultimat… Show more

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