Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

Mohamed, Mohamed Gamal; Kuo, Shiao‐Wei

doi:10.3390/polym11010026

Cited by 140 publications

(84 citation statements)

References 86 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Polyhedral oligomeric silsesquioxane (POSS) is an organic-inorganic hybrid nanomaterial [7,8]. The composite resin with POSS as a filler has good biocompatibility and mechanical properties [9][10][11][12][13][14]. POSS is represented by the unique formula (RSiO 3/2 ) n , where n is the number of the silicon atoms of the cage (1-3 nm in size) surrounded by organic corner groups (R).…”

Section: Introductionmentioning

confidence: 99%

Study of POSS on the Properties of Novel Inorganic Dental Composite Resin

Wang

Liu

et al. 2020

Polymers

View full text Add to dashboard Cite

Various amounts of methacryl polyhedral oligomeric silsesquioxane (POSS) were explored to be incorporated into novel nano SiO2 dental resin composites using light curing method. The scanning electron microscopy (SEM), optical microscopy, fourier transform infrared spectroscopy (FTIR), nanoindentation, nanoscratch and three-point flexure tests were performed. The volumetric shrinkage and mechanical properties such as hardness, elastic modulus, resistance, flexural strength and fracture energy were analyzed. With the additions of POSS, the volume shrinkage decreased and the mechanical properties initially increased. The effects of POSS on these properties were studied to provide a reference for clinically selecting a composite resin with excellent properties.

show abstract

Section: Introductionmentioning

confidence: 99%

Study of POSS on the Properties of Novel Inorganic Dental Composite Resin

Wang

Liu

et al. 2020

Polymers

View full text Add to dashboard Cite

show abstract

“…To further observe the homogeneity of the nanometer‐sized POSS particles dispersion, the samples were examined by TEM . Figure shows POSS are uniformly dispersed throughout the matrix.…”

Section: Resultsmentioning

confidence: 99%

Phenolic resin/polyhedral oligomeric silsesquioxane (POSS) composites: Mechanical, ablative, thermal, and flame retardant properties

Dong

Yang

2019

Polymers for Advanced Techs

View full text Add to dashboard Cite

Three different polyhedral oligomeric silsesquioxanes (POSS), trisilanolphenyl polyhedral oligomeric silsesquioxane (T-POSS), octaaminophenyl polyhedral oligomeric silsesquioxanes (OAPS), and octaphenyl polyhedral oligomeric silsesquioxanes (OPS) were incorporated into phenolic resin (PR), respectively; PR/POSS composites were successfully prepared, and the properties of PR/POSS composites were studied. The limiting oxygen index (LOI), cone calorimeter, and thermal gravimetric analysis (TGA) were used for the estimation of flame retardancy and thermal stability. Oxyacetylene flame test and flexural strength test were used to study the ablative and mechanical properties of the PR/POSS composites. The results indicated that T-POSS was more effective in improving the flame retardancy of PR than OAPS or OPS. Meanwhile, compared with pure PR, the second line ablation rates of PR/4%T-POSS, PR/4% OAPS, and PR/4% OPS were significantly reduced by 53.3%, 61.9%, and 40.0%, respectively. In addition, the thermal stability and flexural strength of PR/4% T-POSS were significantly higher than that of all other PR composites.

show abstract

“…Polyimide (PI) is a well‐known engineering plastic that possesses excellent thermal stability, high chemical resistance, good mechanical properties as well as a low dielectric constant (low‐ k ) . Therefore, they have become an excellent candidate for microelectronics applications, such as interlayer dielectrics and flexible circuitry carriers .…”

Section: Characteristics Of the 6fda‐oda Pi Filmmentioning

confidence: 99%

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Dong

et al. 2019

Macro Materials & Eng

View full text Add to dashboard Cite

Porous interior structured polyimide (PI) films with a hierarchical surface are fabricated from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride and 4,4′‐oxydianiline by a water vapor induced phase separation process under a humid environment. Superhydrophobic properties with a water contact angle of 161° are obtained using the hierarchical surface morphology, which can be adjusted from flower‐like to wrinkle‐shape particles facilely by changing the relative humidity. The dielectric constant (k) of the PI film decreases sharply from 2.8 (film prepared under dry conditions) to ≈1.9 (film prepared under humid conditions) because of the interior porous structure and fluorine‐containing framework. Both a low‐k and superhydrophobicity are very important parameters for PI films in microelectronic and insulating applications.

show abstract

Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

Cited by 140 publications

References 86 publications

Study of POSS on the Properties of Novel Inorganic Dental Composite Resin

Study of POSS on the Properties of Novel Inorganic Dental Composite Resin

Phenolic resin/polyhedral oligomeric silsesquioxane (POSS) composites: Mechanical, ablative, thermal, and flame retardant properties

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Contact Info

Product

Resources

About