2022
DOI: 10.1016/j.surfin.2022.101917
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Fundamentals, present status and future perspective of TOPCon solar cells: A comprehensive review

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Cited by 40 publications
(31 citation statements)
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“…The advantages of this technique include the simple processing and equipment requirements, and it can be accomplished using only a diffusion furnace with laser doping equipment and cleaning equipment. 193 High-temperature annealing is usually required for the preparation of TOPCon structures to realize crystallization and to activate doping. However, annealing in a high-temperature furnace can cause a number of issues: rst, the deterioration of the tunnel oxide and its interfaces; second, increased Auger recombination due to dopant diffusion from poly-Si into the base; third, insufficient dopant activation in poly-Si; and, nally, shortened absorber lifetimes as a result of prolonged high-temperature exposure.…”
Section: Laser-related Applicationsmentioning
confidence: 99%
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“…The advantages of this technique include the simple processing and equipment requirements, and it can be accomplished using only a diffusion furnace with laser doping equipment and cleaning equipment. 193 High-temperature annealing is usually required for the preparation of TOPCon structures to realize crystallization and to activate doping. However, annealing in a high-temperature furnace can cause a number of issues: rst, the deterioration of the tunnel oxide and its interfaces; second, increased Auger recombination due to dopant diffusion from poly-Si into the base; third, insufficient dopant activation in poly-Si; and, nally, shortened absorber lifetimes as a result of prolonged high-temperature exposure.…”
Section: Laser-related Applicationsmentioning
confidence: 99%
“…The advantages of this technique include the simple processing and equipment requirements, and it can be accomplished using only a diffusion furnace with laser doping equipment and cleaning equipment. 193…”
Section: Technical Challenges and Prospectsmentioning
confidence: 99%
“…Next, a mask layer was prepared on i-a-Si for a cover; (4) removing the winding i-a-Si layer formed in the LPCVD process at the front of substrate; (5) p + -type dopant was performed through thermal diffusion of B elements into the front of n-Si by the BBr 3 source. Subsequently, the annealing process at 900 °C for 60 min was executed, and the i-a-Si film was transformed to the polycrystalline poly-Si (n + ) structure; (6) BSG (borosilicate glass) at the top of the device was taken off with the mask layer at the back; (7) the passivation layers for both 70 nm AlO x /SiN x at the front and 30 nm SiN x at rear of the device were fabricated, respectively; (8) Ag electrodes were screen printed by silver paste at both sides of the device and then sintered at the temperature of 800 °C.…”
Section: ■ Experimental Detailsmentioning
confidence: 99%
“…5 TOPCon solar cell may become one of the mainstream of c-Si-based PV industrial products in the future market. 6,7 For the n-type TOPCon device, the effective doping of P elements incorporated into the crystallites of the poly-Si (n + ) film and activated by the loss of an extra valence electron lets the charged P + ion play a field passivation effect to decrease carrier's recombination at the interfaces of n-Si/SiO x /poly-Si (n + ). The overlying of the poly-Si (n + ) layer on the n-Si/SiO x structure to achieve electron selective transport is based on the energy band off at the heterojunction.…”
Section: ■ Introductionmentioning
confidence: 99%
“…A general aim of the photovoltaic (PV) industry is to reduce process times to decrease the cycle time of a solar cell and increase the throughput. [1] This work focuses on reducing the process time of the contact drying step [2][3][4] (t DRY ) for high-temperature solar cell devices like passivated emitter and rear cells (PERC) [5][6][7] and tunnel oxide passivated contact (TOPCon) cells [8][9][10][11][12][13] while maintaining the level of the solar cell performance. The drying process is required after the screen-printing of metal pastes (electrodes) on the solar wafer substrate.…”
Section: Introductionmentioning
confidence: 99%