GaAs/AlAs Coupled Multilayer Cavity by Wafer-Bonding for Two-Color Emission Devices

Harayama, Chiho; Katoh, Seiji; Nakagawa, Y.; Morita, Kenji; Kitada, Takahiro; Isu, Toshiro

doi:10.7567/ssdm.2013.k-4-4

Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials 2013

DOI: 10.7567/ssdm.2013.k-4-4

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GaAs/AlAs Coupled Multilayer Cavity by Wafer-Bonding for Two-Color Emission Devices

Chiho Harayama¹,

Seiji Katoh²,

Y. Nakagawa³

et al.

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GaAs/AlAs Coupled Multilayer Cavity by Wafer-Bonding for Two-Color Emission Devices

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