Glass Cutting Technology Combining Two Different Lasers

Кондратенко, В. С.; Kobysh, A. N.; Hung-Tu, Lu; Naumov, A. S.; Velikovskii, I. E.

doi:10.1007/s10717-020-00273-w

Cited by 4 publications

(2 citation statements)

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“…Significant improvement of the ablation quality of fused silica was achieved than any single laser processing. The two-laser hybrid processing is also capable of enhancing processing efficiency 162 . The processing efficiency of laser machining of BK7 glasses by two lasers with different pulse widths was increased by 2.3 times that of a single laser 163 .…”

Section: Hybrid Laser Processing By Two Lasersmentioning

confidence: 99%

Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

2021

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Laser has been demonstrated to be a mature and versatile tool that presents great flexibility and applicability for the precision engineering of a wide range of materials over other established micromachining techniques. Past decades have witnessed its rapid development and extensive applications ranging from scientific researches to industrial manufacturing. Transparent hard materials remain several major technical challenges for conventional laser processing techniques due to their high hardness, great brittleness, and low optical absorption. A variety of hybrid laser processing technologies, such as laser-induced plasma-assisted ablation, laser-induced backside wet etching, and etching assisted laser micromachining, have been developed to overcome these barriers by introducing additional medium assistance or combining different process steps. This article reviews the basic principles and characteristics of these hybrid technologies. How these technologies are used to precisely process transparent hard materials and their recent advancements are introduced. These hybrid technologies show remarkable benefits in terms of efficiency, accuracy, and quality for the fabrication of microstructures and functional devices on the surface of or inside the transparent hard substrates, thus enabling widespread applications in the fields of microelectronics, bio-medicine, photonics, and microfluidics. A summary and outlook of the hybrid laser technologies are also highlighted.

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Section: Hybrid Laser Processing By Two Lasersmentioning

confidence: 99%

Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

2021

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“…[2] Picosecond ultrafast lasers show great advantages because of their extremely narrow pulse width, and use the characteristics of low thermal energy diffusion to complete material interruption before heat conduction to the surrounding material, showing good results in brittle material cutting. [3] The transverse optical field distribution of the Bessel beam does not change with the propagation of the beam, and the main lobe diameter can be as small as a few microns, but the focal depth can reach a few millimeters, so the Bessel beam is often used to process the optical waveguide with the ratio of height to depth. In glass laser cutting, the ablation threshold of different glass materials is different.…”

Section: Introductionmentioning

confidence: 99%