Glue selection for robust wire bonding process related to non-stick on pad

Chung, Ee Lin; Ge, Dandong; Wai, Chee Mun

doi:10.1109/eptc.2017.8277514

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 2017

DOI: 10.1109/eptc.2017.8277514

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Glue selection for robust wire bonding process related to non-stick on pad

Ee Lin Chung¹,

Dandong Ge

Chee Mun Wai³

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Glue selection for robust wire bonding process related to non-stick on pad

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References 5 publications

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