Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process

Guarino, L.; Caglio, C.; Villa, R.; Carasi, B.; Passagrilli, C.; Cecchetto, L.

doi:10.1109/eptc59621.2023.10457872

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457872

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Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process

L. Guarino,

C. Caglio,

R. Villa

et al.

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Acoustic softening characterization to improve copper wire bonding FEM simulation

Guarino,

Caglio,

Carasi

et al. 2024

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Acoustic softening characterization to improve copper wire bonding FEM simulation

Guarino,

Caglio,

Carasi

et al. 2024

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process

Cited by 1 publication

References 6 publications

Acoustic softening characterization to improve copper wire bonding FEM simulation

Acoustic softening characterization to improve copper wire bonding FEM simulation

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