2013
DOI: 10.1016/j.nimb.2013.03.007
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Hard TiCx/SiC/a-C:H nanocomposite thin films using pulsed high energy density plasma focus device

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Cited by 26 publications
(15 citation statements)
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References 38 publications
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“…The electrode system of UNU/ICTP PFF hosted in a steel chamber is energized by a single Maxwell fast discharging capacitor (30 µF, 15 kV) with a maximum energy up to 3.3 kJ. The details of UNU/ICTP PFF and its operation can be found elsewhere (12,21,22). The electrode system of UNU/ICTP PFF consists of a copper anode surrounded by six copper rods serving as cathodes and this electrode system is hosted in a steel chamber which is evacuated by a rotary van vacuum pump down to a pressure of 10 −2 mbar.…”
Section: Methodsmentioning
confidence: 99%
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“…The electrode system of UNU/ICTP PFF hosted in a steel chamber is energized by a single Maxwell fast discharging capacitor (30 µF, 15 kV) with a maximum energy up to 3.3 kJ. The details of UNU/ICTP PFF and its operation can be found elsewhere (12,21,22). The electrode system of UNU/ICTP PFF consists of a copper anode surrounded by six copper rods serving as cathodes and this electrode system is hosted in a steel chamber which is evacuated by a rotary van vacuum pump down to a pressure of 10 −2 mbar.…”
Section: Methodsmentioning
confidence: 99%
“…Figure 6 shows 3D topography of the exposed substrate for various (11,22 and 33) deposition shots along with the unexposed substrate. While the root mean square (RMS) roughness of substrates is determined by AFM and given in Figure 7.…”
Section: Atomic Force Microscopymentioning
confidence: 99%
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“…The result also highlights the high film deposition rate of 106.7 nm per plasma focus shot. However increase in film thickness with increasing number of focus shots is found to be non-linear which is attributed to the variation in focusing/pinching efficiency in each focus shot of plasma focus device [49,50].…”
Section: Sem Analysismentioning
confidence: 98%
“…The modified DPF device with suitable modification has been used worldwide for the fabrication of nanoparticles and nanostructures of different materials [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 ]. In most of these studies, the modification of anode is almost similar but the arrangement for placing the substrate varies.…”
Section: Introductionmentioning
confidence: 99%