Heat dissipation for MID applications in lighting technology

Barth, Maximilian; Kulkarni, Romit; Eberhardt, W.; Meibner, Thomas; Soltani, Mahdi; Zimmermann, André

doi:10.1109/icmid.2016.7738938

Cited by 6 publications

(4 citation statements)

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“…This behavior confirms previously gained findings and is consistent with the results from earlier investigations [16,17,24]. The main effects plot for the maximum temperature, shown in Figure 17, validates these observations and shows that the difference between the two ambient temperatures stages has the higher impact (steeper slope).…”

Section: Resultssupporting

confidence: 92%

“…Other research works concerning different procedures for accelerated life tests were presented in References [12][13][14][15]. Several studies consider the thermal performance of LEDs on MIDs [16][17][18][19][20] by investigating the effects of different heat dissipation concepts on the heating of the p-n junction. Other studies focus on the reliability of surface mounted devices (SMD) on MIDs under thermal cyclic testing with respect to the thermomechanical behavior and the void formation in the solder joints [21][22][23].…”

Section: Introductionmentioning

confidence: 99%

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Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

et al. 2018

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Higher energy efficiency, more compact design, and longer lifetime of light-emitting diodes (LEDs) have resulted in increasing their market share in the lighting industry, especially in the industries of consumer electronics, automotive, and general lighting. Due to their robustness and reliability, LEDs have replaced conventional light sources, such as fluorescent lamps. Many studies are examining the reliability of LEDs as such or investigating their long-term behavior on standard printed circuit boards (PCB). However, the thermal performance of LEDs mounted on nonconventional substrates is still not explored enough. An interesting example for this is the molded interconnect devices (MID), which are well known for the great design freedom and the great potential for functional integration. These characteristics not only underline the main abilities of the MID technology, but also present some challenges concerning thermal management. The long-term behavior of LEDs on MID is still quite untapped and this prevents this technology from consolidating its existence. In this context, this work highlights a developed test setup aimed at investigating LEDs, mounted on molded interconnect devices, under combined stress conditions. The results of the reliability study, as well as the resulting lifetime model, are also illustrated and discussed.

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Section: Resultssupporting

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

et al. 2018

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“…This kind of procedure and its steps (geometry, meshing, boundary conditions, etc.) was already explained in previous works [1], [2]. In this manuscript, the focus lies on the second procedure, with respect to the triggered fiber orientation, which will be addressed in the next subsection.…”

Section: A Approach and Design Of Experimentsmentioning

confidence: 94%

“…This technology enables the simultaneous integration of mechanical (e.g. substrate by injection molding [1], [2]), electrical (e.g. electrical layout by laser direct structuring [3]) and thermal functions (e.g.…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

et al. 2019

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Due to many advantages, such as cost-effective production, design freedom, and weight reduction, plastics have replaced metals and ceramics in many fields. However, engineering plastics are good thermal insulators. This characteristic, although beneficial in certain applications, poses many challenges in many heat-generating applications. This can lead to hot spots or even to an increase in the device temperature. Along with the increasing demand for plastics in areas of the lighting technology or in the automotive field due to the free shaping potential, the requirements are becoming more challenging. Driven by the trend of miniaturization, applications with high heat generation often have to operate in the tightest of spaces. Since not always sufficient space for complex cooling systems is given, the housing or the substrate should assume the task of thermal management. In regard to this fact, the use of thermally conductive thermoplastics seems to be very appealing. Quality loss, poorer reliability, loss of performance, and even failure can occur in case of insufficient heat dissipation. In order to improve the properties of these polymers, highly heat-conducting fillers are added in order to improve the thermal conductivity of the compound. Another technology trend that has been prevalent for years is the use of simulations. Due to shorter product life cycles and therefore shorter development times, simulation has become an indispensable part of the chain of product development. Timeconsuming and costly test series make the simulation more and more important as a tool for material and product design. In this context, this paper presents a novel approach for reliability investigation and lifetime estimation, based on simulation. Therefore, a simulative method based on coupling the results from the process simulation (injection molding simulation) to finite element analysis was developed and explained. This coupled method makes it possible to take into account the manufacturing process and its engendered filler orientation. The obtained findings are compared to conventional thermal steady-state analysis and used in order to better predict the lifetime of LEDs mounted on thermoplastic substrates, the so-called molded interconnect devices. It is demonstrated that it is necessary to consider the filler orientation, especially in the case of 3D substrates.

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Improvement of thermal conductivity and dielectric constant of graphene-filled epoxy nanocomposites using colloidal polymerization approach

et al. 2019

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Heat dissipation for MID applications in lighting technology

Cited by 6 publications

References 0 publications

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Improvement of thermal conductivity and dielectric constant of graphene-filled epoxy nanocomposites using colloidal polymerization approach

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