Hierarchical power budgeting for Dark Silicon chips

Abstract

The emerging Dark Silicon limitation has led the application designers to carefully consider the available Thermal Design Power (TDP) budgets, hardware resources, and software characteristics. In this paper, we propose a hierarchical scheme for distributing the resources and TDP budget among concurrently executing applications with multi-threaded workloads under throughput constraints. Afterwards, the application-level TDP budget is partitioned among its threads depending upon their workloads, which can then be fine-tuned at run time considering workload variations. We evaluate our scheme for the next-generation, multi-threaded, High Efficiency Video Codec and demonstrate that up to 30.86% higher throughput is achieved compared to the state-of-the-art.