High frequency characterization of a chip scale BGA package

The presence of discontinuities (e.g., vias, bends...) along a uniform signal path distorts the electromagnetic (EM) field pattern, resulting in signal integrity (SI) effects especially at RF/microwave frequencies. Such effects, which also arise when geometrical and material parameters of components in chips, packages and boards unexpectedly change during the fabrication process, may lead to a degradation of the system performance, if not accounted for at the genesis of the development process. In this work, we examine the effects of discontinuities and technological fluctuations on the radio frequency (RF) performance of ball grid array (BGA) packages. For this purpose, an equivalent circuit model of the complete signal path' in a BGA package was developed for frequencies up to 25 GHz. The impact of multiple bends and vias on the signal quality was studied using this model. Furthermore, effects of up to 30% variation in material and geometrical parameters of each package component on its electrical characteristics and on the RF performance of the entire package were also critically investigated using the wideband package model. Based on the results of these investigations, design guidelines which can then be applied at the beginning of the development process to reduce cost and time, were deduced

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Component packaging footprint: Surprising element of high speed filter design

Rahman¹,

Broman²,

Howieson³

2011

2011 Ieee International Conference on Electro/Information Technology

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It is very intriguing to design passive filters in a very small package, in the frequency domain of 10 GHz and above. Modeling the device footprint and correctly incorporate the model in the design work to design passive filter is key to successfully manufacture surface mount filter components that perform as expected, once they are mounted to the printed circuit board. This requires accurate correlation to the filter model and the measured first article component. In this work we studied footprint and it's influence in the final product. We developed filter design procedure using simulation software. We considered the impact of the parasitic of the input signal lines, printed circuit board's footprint parasitic, and filter's signal launch pad loss. We discussed an efficient way to design low pass passive filters in Ball Grid Array package; we optimized the design flow to manufacture filters. Then we designed and manufactured 12 GHz 9 th order absorptive low pass Bessel filter, whose size is 2.0 mm X 7.1 mm. We compared the measured data of the fabricated filter with the simulation results. We discussed the use of Coaxial Measurement Modules, which contains the filter with optimized design footprint.

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High frequency characterization of a chip scale BGA package

Cited by 4 publications

References 6 publications

Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications

Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications

Effects of discontinuities and technological fluctuations on the RF performance of BGA packages

Component packaging footprint: Surprising element of high speed filter design

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