Abstract:As device geometries scale, product complexity has increased with more and more functionality embedded into integrated chips in recent times. In the processor domain, multiple cores with associated glue logic and cache all on a single die are becoming more and more popular. At the same time, product frequencies have gone up and the need to test for delay defects and marginal circuits is rising continually. This is exacerbated in recent times with the focus on lowpower design. While there has been a lot of prog… Show more
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